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aku6.1
- PLATFORM BUILDER FOR WINDOWS MOBILE 5.0、6.1,AKU FOR WM6.1 ,aku for windows mobile 6.1,aku 6.1 for windows mobile,开发平台,编译系统,带BSP包,有s3c2440,s3c2442,sc32442,s3c2416,s3c2450,s3c2451,s3c6400,s3c6410,pxa300,pxa310,pxa320,pxa312的WM BSP包,PDF文档,altas A4,Atlas
aku6.1.rar
- PLATFORM BUILDER FOR WINDOWS MOBILE 5.0、6.1,AKU FOR WM6.1 ,aku for windows mobile 6.1,aku 6.1 for windows mobile,开发平台,编译系统,带BSP包,有s3c2440,s3c2442,sc32442,s3c2416,s3c2450,s3c2451,s3c6400,s3c6410,pxa300,pxa310,pxa320,pxa312的WM BSP包,PDF文档,altas A4,Atlas
SMDK2450_WinCE50_PM_REL_0.04_0
- s3c2450 bsp for wince 5.0 PM_REL_0.04_080519 经验证,完全没问题,s3c2450 bsp for wince 5.0 PM_REL_0.04_080519
SMDK2450.rar
- 三星2450平台的整个bsp包的源代码，可以编译成功,Samsung bsp entire 2450 platform source code package can be compiled successfully
SMDK2416.rar
- smdk2416 wince source code/BSP ,smdk2416 wince source code/BSP
SMDK2450_WinCE50_PM_REL_0.03_0
- s3c2450 bsp for wince 5.0 经验证,完全没问题,s3c2450 bsp for wince 5.0 certified, totally no problem
YLP2450_DVK_USER_CD_V13
- S3C2450开发板的全套光盘，包括OrCAD格式原理图、PADS格式封装库、BSP源码包、烧录下载工具和软件，用户手册，编程文档和芯片规格书等等。-S3C2450 development board complete set of CD-ROM format, including OrCAD schematics, PADS format package library, BSP source package, burn download the tools and software, use
S3C2451_UM_REV0[1][1].30_20081020
- 三星2450的资料，很紧俏的文档哟。 非常的完整-Samsung 2450 data, it is tight yo documents
SMDK2450_WM61.ZIP
- SMDK2450 windows mobile 6.1 BSP 对开发windows mobile 很有参考价值-For developing windows Mobile，Base on the S3C2450.