搜索资源列表
SG74LVC14
- 国产芯片SG74LVC14技术资料，可替代TI的 SN74LVC14-Domestic chip SG74LVC14 technical information, alternative TI' s SN74LVC14
OpAmp
- 运算放大器稳定性分析(TI合集)，详细介绍运放使用-Operational Amplifier Stability Analysis (TI Collection), detailing the use of the op amp
CC1101-LAYOUT
- 这是参考官方设计手册做的一个CC1101模块，实测有效直线通信距离200米，绘制环境AD16(附51，MSP430程序设计参考资料以及TI PCB参考设计)-This is the official reference manual designed to do a CC1101 module, found effective communication distance of 200 meters straight draw Environment AD16 (Annex 51, MSP430
TQ335X_COREC-20130801
- TI公司AM335X核心板电路，嵌入式硬件设计必备电路图。-the circuit of TI AM335X SOC,which is a must for the hardware engineer of SOC design.
bq40z60flash_config_file
- TI 公司的bq40z60锂电源管理芯片配置文件,-a config file of bq40z60 battery management
2.4G--F
- TI 2.4G倒F天线实测可用,可用于设计双面板-2.4G ANT
BeagleBoneBlackB3_Altium
- beaglebone black是TI公司出的AM3359芯片，是一款性价比极高的ARM Cortex-A8内核芯片，BBB这块板子也是TI公司的官方指定开发板之一，附件是官方原理图-BeagleBone Black is a low-cost, community-supported development platform for developers and hobbyists.
LM386-200
- 这个模块是一个利用TI公司LM386放大芯片设计的放大200倍增益的电路，实测做出来的电路最多可以达到100倍左右的增益。-This module is a use of TI amplifier LM386 chip designed to amplify 200 times the gain of the circuit, the circuit can be measured to achieve up to about 100 times the gain.
TI 培训(MSP430F6638)_PPT
- msp430f6638的学习例程，包括LED,LCD,按键，ADC,DAC各种模块(Msp430f6638 learning routines, including LED, LCD, buttons, ADC, DAC various modules)
MS_TI_CSK_TMDSCSK8127_SCH_PRDN_REVA
- ti公司原版的evm板子的dm8127的.DSN原理图(.DSN schematic diagram of dm8127)
Texas Instruments
- Texas Instruments常用元件库 TI Analog Timer Circuit.IntLib TI Logic Flip-Flop.IntLib TI Logic Gate 1.IntLib TI Logic Gate 2.IntLib TI Logic Latch.IntLib TI Logic Switch.IntLib TI Power Mgt Voltage Reference.IntLib TI Power Mgt Voltage Regulator.In